Journal of Research in VLSI Design Tools and Technology ISSN: 3139-2016 (Online)

Authors: Surya Venkatesh, Nithya Sundar

Abstract: The increasing complexity and performance requirements of modern integrated circuits (ICs) have driven the need for efficient and scalable interconnect solutions. On-chip and off-chip interconnects play a crucial role in determining the overall performance, power consumption, and reliability of electronic systems. This paper provides a comprehensive review of on-chip and off-chip interconnect technologies, highlighting their key characteristics, challenges, and advancements. Additionally, tables and figures are included to illustrate the comparative analysis and trends in interconnect technologies.

Keywords: On-Chip Interconnects, Off-Chip Interconnects, Metal Layers, Low-k Dielectrics, Flip-Chip, Wire Bonding, Interconnect Density, Reliability, Semiconductor Packaging, Signal Propagation Delays