Authors: Naina Sharma, Deepak Kumar, Sheetal Chaudhary
Abstract: Micro-Electro-Mechanical Systems (MEMS) have revolutionized various industries, including automotive, biomedical, and telecommunications. The integration of MEMS with Very Large Scale Integration (VLSI) technology has opened new avenues for developing highly compact, efficient, and multifunctional devices. This paper explores the various methodologies, challenges, and advancements in integrating MEMS with VLSI. It highlightsm the critical aspects of MEMS-VLSI co-design, fabrication techniques, packaging, and applications. Furthermore, it discusses the challenges faced in terms of reliability, scalability, and cost-effectiveness, while also considering the future trends and potential breakthroughs in this rapidly evolving field.
Keywords: MEMS, VLSI, MEMS-VLSI Integration, Fabrication Techniques, Co-Design, Packaging, Applications
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