Abstract
The packaging and interconnection technologies of power devices play a critical role in the performance, reliability, and efficiency of power electronic systems. The challenges faced by these technologies include thermal management, parasitic effects, high power density, and integration with other components. This paper discusses the challenges faced by packaging and interconnection technologies of power devices and explores the future trends in these technologies. The future trends include advanced materials, 3D packaging, system-in-package, and wireless interconnection. These trends require significant advancements in thermal management, interconnection, and compatibility with different materials and technologies. The paper concludes that innovative solutions are required to address the challenges faced by packaging and interconnection technologies to meet the demands of modern power electronic systems.
Keywords: Power Devices, Packaging Technologies, Interconnection Technologies, Challenges, Future Trends
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