Chiplet-Based Modular Embedded Architectures

Abstract

The increasing demand for high-performance embedded systems in applications such as Internet of Things (IoT), automotive electronics, and edge computing has created a need for scalable, energy-efficient, and modular hardware architectures. Traditional monolithic System-on-Chip (SoC) designs face challenges related to power consumption, yield, cost, and design complexity. Chiplet-based modular embedded architectures emerge as a promising solution, allowing designers to integrate heterogeneous computing, memory, and specialized functional blocks as smaller, pre-verified chiplets. This paper reviews the recent advancements in chiplet technology, explores integration techniques, highlights advantages, challenges, and potential applications, and provides insights into future research directions. The study also examines the role of interconnect technologies, packaging, and standardization efforts in promoting chiplet adoption for modular embedded systems.