3D and Heterogeneous Integration for Next-Generation Chips

Abstract

ABSTRACT With the relentless scaling limitations of Moore’s Law, traditional 2D integrated circuits (ICs) face challenges in improving performance, energy efficiency, and functionality. 3D integration and heterogeneous integration have emerged as promising solutions to overcome these limitations. This paper presents a comprehensive review of the current trends in 3D and heterogeneous integration, focusing on the architectural, technological, and manufacturing aspects. It highlights recent advancements in through-silicon vias (TSVs), interposer technologies, chiplet-based design, and heterogeneous materials integration. The paper also discusses the challenges related to thermal management, signal integrity, and reliability, and provides a perspective on the future of next-generation chips.

KEYWORDS: 3D ICs, heterogeneous integration, chiplets, TSV, interposer, thermal management, next-generation chips, advanced packaging